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Repair/
Maintenance
Guidelines
This section provides guidelines for repairing and maintaining the Agilent
E1445A AFG, including:
• ESD precautions
• Soldering printed circuit boards
• Post-repair safety checks
ESD
Precautions
Electrostatic discharge (ESD) may damage static sensitive devices in the
Agilent E1445A AFG. This damage can range from slight parameter
degradation to catastrophic failure. When handling AFG assemblies, follow
these guidelines to avoid damaging AFG components:
• Always use a static-free work station with a pad of conductive rubber
or similar material when handling AFG components.
• If a device requires soldering, be sure the assembly is placed on a
pad of conductive material. Also, be sure that you, the pad, and the
soldering iron tip are grounded to the assembly.
Soldering Printed
Circuit Boards
When soldering to any circuit board, keep in mind the following guidelines:
• Avoid unnecessary component unsoldering and soldering. Excessive
replacement can result in damage to the circuit board and/or adjacent
components.
• Do not use a high power soldering iron on etched circuit boards, as
excessive heat may lift a conductor or damage the board.
• Use a suction device or wooden toothpick to remove solder from
component mounting holes. When using a suction device, be sure
that the equipment is properly grounded.
Post-Repair
Safety Checks
After making repairs to the Agilent E1445A AFG, inspect the AFG for any
signs of abnormal internally generated heat, such as discolored printed
circuit boards or components, damaged insulation, or evidence of arcing.
Determine and correct the cause of the condition. Then perform the
Self-Test described in Chapter 2 to verify that the AFG is functional.
Agilent E1445A Service Manual Service 125