Telit Wireless Solutions 1vv0300773a Chipper User Manual


 
GE863-PRO
3
Hardware User Guide
1vv0300773a Rev. 0 - 24/01/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 59 of 64
11.1.5 Packing System
According to SMT processes for pick & place movement requirements, Telit GE863-PRO
3
modules are
packaged on trays, each tray contains 20 pieces. Tray dimensions are:
Note that trays can withstand a maximum temperature of 65° C.
320 ± 0,3
170 ± 0,3
All quotes are in mm, general tolerance ± 0.1
6.1
Section A-A