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GE863-PRO
3
Hardware User Guide
1vv0300773a Rev. 0 - 24/01/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 55 of 64
11 Mounting the GE863-PRO
3
on the
Application Board
11.1 General
The Telit GE863-PRO
3
module has been designed in order to be compliant with a standard lead-free SMT
process
11.1.1 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
11.1.2 PCB pad Design
“Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.