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Thermal and Mechanical Design Guidelines 39
Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Heatsink Assembly
()55.88
2.200[]
C
()33
1.299[]
B
()19
.748[]
()19
.748[]
NOTES:
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED ST ATE UNLESS
INDICATED OTHERWISE.
2. FINISH: NONE
3. ALL SECONDARY UNIT DIMENSIONS ARE FOR REFERENCE ONLY. TOLERANCES
SHALL BE CALCULATED FROM PRIMARY UNITS TO AVOID TRUNCATION ERRORS.
4. ITEMS WITHOUT INTEL PART NUMBER SHALL BE MANAGED
AND PROCURED BY SUPPLIER
5 .ASSEMBLY TO BE MARKED WITH INTEL P/N APPROX. WHERE SHOWN.
6. ATTACH THERMAL INTERFACE MATERIAL WHERE SHOWN. REMOVABLE PROTECTIVE
BARRIER APPLIED OVER INTERFACE MATERIAL.
0.25 [.009] A B C
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