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Thermal and Mechanical Design Guidelines 29
Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms
8X PLATED THRU HOLE
8X 1.42[.056] TRACE KEEPOUT
0.97 .038[]
4
.1575[]
74
2.9134[]
47
1.85[]
60.92
2.398[]
4X 8.76
.345[]
4X 8.76
.345[]
4X 1.84
.072[]
4X 5.08
.200[]
81
3.189[]
60.6
2.386[]
26.79
1.055[]
45.79
1.803[]
135
48
1.890[]
67
2.638[]
DETAIL A
NO COMPONENTS THIS AREA
MAX 1.27 [.050]
COMPONENT HEIGHT
(NON-MCH COMPONENTS)
NOTES:
1 HOLE PLACEMENT FABRICATION
TOLERANCE PER INTEL 454979, CLASS 1,2,3
2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED
38.1MM ABOVE MOTHERBOARD SURFACE.
COMPONENT CENTER
NORTH
EAST
MAX 25 [1.000]
COMPONENT HEIGHT
DETAIL A
SCALE 8