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30 Thermal and Mechanical Design Guidelines
Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms
4X 8.76
.3 45[]
4X 4.19
.1 65[]
4X 1.85
.073[]
4X 5.08
.20 0[]
4X 2.1
.083[]
8X PLATED THRU HOLE0.97 .038[]
48.26
1.900[]
55.88
2.200[]
2X 3.3
.1 30[]
2X 2.29
.0 90[]
2X 2.54
.1 00[]
2X 5.72
.2 25[]
61.98
2.440[]
46.48
1.830[]
B
8X 1.42[.056] TRACE KEEPOUT
D ETAIL A
N O C OMPON EN TS TH IS AR EA
MAX 1 .27[.0 50] C O MPON ENT H EIG H T
D ETAIL B
MAX 1.7 8[.070 ] CO MPON EN T HEIGH T
NOTES:
1 . H O LE PLAC EMEN T FABR IC ATIO N
TOLERANCE PER INTEL 454979, CLASS 1,2,3
2. HEATSINK COMPONENT HEIGHT NOT TO EXCEED
26.9MM ABOVE MOTHERBOARD SURFACE.
COMPONENT CENTER
SCALE 4
DETAIL A
SCALE 8
DETAIL B
SCALE 5